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Patent Searching and Data


Title:
POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND POLYIMIDE FILM/SUBSTRATE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/114136
Kind Code:
A1
Abstract:
Provided is a polyimide precursor composition with which it is possible to manufacture a polyimide film that has excellent thermal characteristics and/or thermal resistance, and that has excellent transparency. The polyimide precursor composition comprises a repeating unit including a repeating unit expressed by the following general Formula (I) and a repeating unit obtained by further imidizing the general Formula (I), and contains a polyimide precursor having an imidization ratio of more than 0% and less than 50% and a solvent. (where 70 mol% or more of X1 is a structure expressed by Formula (1-1), and 70 mol% or more of Y1 is a structure expressed by Formula (D-1) and/or (D-2).)

Inventors:
OKA TAKUYA (JP)
KOHAMA YUKINORI (JP)
SAKAI TOSHIHITO (JP)
Application Number:
PCT/JP2021/043417
Publication Date:
June 02, 2022
Filing Date:
November 26, 2021
Export Citation:
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Assignee:
UBE INDUSTRIES (JP)
International Classes:
B32B27/34; C08G73/10; C08L79/08; H05K1/03
Domestic Patent References:
WO2015080158A12015-06-04
WO2019163703A12019-08-29
WO2018143314A12018-08-09
Foreign References:
JP2019059959A2019-04-18
JP2018066017A2018-04-26
JP2017160360A2017-09-14
JP2001144119A2001-05-25
JPH05347461A1993-12-27
JP2006240073A2006-09-14
JPH04334088A1992-11-20
JP2017197645A2017-11-02
JP2016030760A2016-03-07
JPH05295115A1993-11-09
Attorney, Agent or Firm:
ITO Katsuhiro (JP)
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