Title:
POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/054612
Kind Code:
A1
Abstract:
A polyimide precursor composition according to the present invention enables alleviation of thermal expansion-contraction properties of a polyimide film resultingly prepared, by means of using siloxane-based diamine having a particular structure and a solvent having a positive partition coefficient. And the present invention enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.
Inventors:
YUN CHEOLMIN (KR)
KIM KYUNGJUN (KR)
KIM KYUNGJUN (KR)
Application Number:
PCT/KR2018/007733
Publication Date:
March 21, 2019
Filing Date:
July 09, 2018
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G73/10; C08J5/18; G02F1/1333; H01L21/02
Foreign References:
| KR20160097685A | 2016-08-18 | |||
| KR20170057458A | 2017-05-24 | |||
| KR20160067413A | 2016-06-14 | |||
| KR20160108252A | 2016-09-19 | |||
| JP2017119868A | 2017-07-06 | |||
| US20090088551A1 | 2009-04-02 | |||
| KR101840977B1 | 2018-03-21 | |||
| KR20170117989A | 2017-10-24 |
Other References:
See also references of EP 3536732A4
Attorney, Agent or Firm:
KIM, Aera (KR)
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