Title:
POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2023/048121
Kind Code:
A1
Abstract:
Provided are: a precursor composition from which a polyimide film having excellent light transmittance, excellent mechanical properties, an excellent coefficient of linear thermal expansion, and excellent resistance to thermal decomposition can be produced; and a polyimide film obtained from this precursor composition. The polyimide precursor composition contains: a polyimide precursor that has a repeating unit represented by general formula (I); at least one type of imidazole compound that is contained in an amount in the range of more than 0.01 moles but not more than 2 moles per 1 mole of the repeating unit of the polyimide precursor; and a solvent. (I) In general formula I, 70 mol% or more of X1 is a structure represented by formula (1-1), and 50 mol% or more of Y1 is a structure represented by formula (B-1).
Inventors:
OKA TAKUYA (JP)
NEMOTO YUKI (JP)
ITO TAICHI (JP)
NEMOTO YUKI (JP)
ITO TAICHI (JP)
Application Number:
PCT/JP2022/034926
Publication Date:
March 30, 2023
Filing Date:
September 20, 2022
Export Citation:
Assignee:
UBE CORP (JP)
International Classes:
C08L79/08; B32B27/34; C08G73/10; C08J5/18; C08K5/3445; H05K1/03
Domestic Patent References:
| WO2016063993A1 | 2016-04-28 | |||
| WO2017030019A1 | 2017-02-23 | |||
| WO2015080158A1 | 2015-06-04 | |||
| WO2022196664A1 | 2022-09-22 | |||
| WO2022176956A1 | 2022-08-25 |
Foreign References:
| JP2018044180A | 2018-03-22 | |||
| JP2022044020A | 2022-03-16 |
Attorney, Agent or Firm:
ITO Katsuhiro (JP)
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