Title:
POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2023/190687
Kind Code:
A1
Abstract:
The present invention provides a polyimide precursor composition for flexible wiring boards, the polyimide precursor composition containing a polyimide precursor that has a repeating unit represented by general formula (I). A polyimide film, which has a low dielectric loss tangent in a high frequency region and excellent heat resistance at the same time, can be produced using this polyimide precursor composition. In the formula, more than 0% by mole but less than 30% by mole of the Y1 moiety has a structure represented by formula (1). In formula (1), A represents a structure represented by formula (A); n represents a number of 1 to 4; m represents a number of 0 to 4; B represents an alkyl group having 1 to 6 carbon atoms, or the like; and U represents -CO-O- or -O-CO-.
Inventors:
YAMAJI KOSUKE (JP)
IIZUMI NOBU (JP)
FUKATA HIROTO (JP)
IWAMOTO KEIJI (JP)
IIZUMI NOBU (JP)
FUKATA HIROTO (JP)
IWAMOTO KEIJI (JP)
Application Number:
PCT/JP2023/012801
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
UBE CORP (JP)
International Classes:
C08G73/10; B32B15/088; B32B27/34; C08J5/18
Domestic Patent References:
| WO2008056808A1 | 2008-05-15 |
Foreign References:
| JPH08157597A | 1996-06-18 | |||
| JP2022518984A | 2022-03-18 | |||
| JP2020204022A | 2020-12-24 | |||
| US20190085131A1 | 2019-03-21 | |||
| JP2009299009A | 2009-12-24 | |||
| JP2011237766A | 2011-11-24 |
Attorney, Agent or Firm:
ITO Katsuhiro (JP)
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