Title:
POLYIMIDE PRECURSOR COMPOSITION, PREPARATION METHOD THEREFOR, AND POLYIMIDE SUBSTRATE MANUFACTURED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2019/004677
Kind Code:
A1
Abstract:
The present invention relates to a polyimide precursor composition, a preparation method therefor, and a polyimide substrate manufactured therefrom. The polyimide precursor composition has a low viscosity while containing a solid part in a high concentration, and thus is advantageous for manufacturing a substrate and has excellent room temperature storage stability. In addition, the polyimide substrate has excellent heat resistance and mechanical properties, and thus is suitably applicable as a display substrate.
Inventors:
HWANG IN HWAN (KR)
KIM JOO YOUNG (KR)
LEE IKSANG (KR)
WON DONG YOUNG (KR)
LIM HYUN JAI (KR)
KIM JOO YOUNG (KR)
LEE IKSANG (KR)
WON DONG YOUNG (KR)
LIM HYUN JAI (KR)
Application Number:
PCT/KR2018/007175
Publication Date:
January 03, 2019
Filing Date:
June 25, 2018
Export Citation:
Assignee:
SKCKOLON PI INC (KR)
International Classes:
C08K5/3432; C08G73/10; C08L79/08
Foreign References:
KR20110079810A | 2011-07-08 | |||
KR20160030889A | 2016-03-21 | |||
KR20110101763A | 2011-09-16 | |||
JP2006328411A | 2006-12-07 | |||
JP2004217785A | 2004-08-05 |
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
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