Title:
POLYIMIDE PRECURSOR, POLYIMIDE, AND FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/102616
Kind Code:
A1
Abstract:
This polyimide precursor, for use in the base film of a flexible printed circuit board, includes diamine-derived structural units and tetracarboxylic dianhydride-derived structural units, and, of all diamine-derived structural units, contains 10-80 mol% dimer diamine-derived structural units, and the weight average molecular weight is 15,000-130,000. A resin composition containing said polyimide precursor, and a polyimide obtained using said polyimide precursor are also provided.
Inventors:
MAENO TOMOAKI (JP)
KAWABATA YASUNORI (JP)
KAWABATA YASUNORI (JP)
Application Number:
PCT/JP2021/041200
Publication Date:
May 19, 2022
Filing Date:
November 09, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G73/10
Foreign References:
| JP2016188298A | 2016-11-04 | |||
| JP2015526561A | 2015-09-10 | |||
| JP2010256532A | 2010-11-11 | |||
| JP2013155329A | 2013-08-15 | |||
| JP2013112735A | 2013-06-10 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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