Title:
POLYIMIDE PRECURSOR RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/208587
Kind Code:
A1
Abstract:
A resin composition which contains, as mentioned in the description of the present application, a polyimide precursor that contains a structural unit represented by general formula (1) and a structural unit represented by general formula (2), and at least either one of the compounds represented by general formula (3-1) or (3-2) wherein m is an integer of 3 or more, and which optionally contains a compound represented by general formula (4). The total amount of the compound represented by general formula (3-1) or (3-2) wherein m is an integer of 3 or more is more than 0 ppm but 1,100 ppm or less based on the mass of the resin composition; or alternatively, the total amount of the compound represented by general formula (3-1) or (3-2) wherein m is an integer of 3 or more and the compound represented by general formula (4) wherein n is an integer of 3 or more is more than 0 ppm but 1,300 ppm or less based on the mass of the resin composition.
Inventors:
KASHIWADA TAKESHI (JP)
OKUDA TOSHIAKI (JP)
SHINOHARA NAOSHI (JP)
OKUDA TOSHIAKI (JP)
SHINOHARA NAOSHI (JP)
Application Number:
PCT/JP2019/017288
Publication Date:
October 31, 2019
Filing Date:
April 23, 2019
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08L79/08; B32B27/34; C08G73/10; C08J5/18; C08L83/04
Foreign References:
JP2007277345A | 2007-10-25 | |||
JPH06293831A | 1994-10-21 | |||
JPS5098600A | 1975-08-05 | |||
JPH08176446A | 1996-07-09 | |||
JP2006028533A | 2006-02-02 | |||
JP2002012666A | 2002-01-15 | |||
JP2016029126A | 2016-03-03 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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