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Title:
POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE RESIN FILM, AND FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/095693
Kind Code:
A1
Abstract:
This polyimide precursor comprises a structure represented by general formula (1) and a structural unit represented by general formula (2). (In general formula (1), each of R1 and R2 independently represents a monovalent organic group having 1-20 carbon atoms; and m represents an integer of from 1 to 200 (inclusive).) (In general formula (2), R3 represents a divalent organic group represented by general formula (3); R4 represents an aromatic tetracarboxylic acid residue; and each of X1 and X2 independently represents a hydrogen atom, a monovalent organic group having 1-10 carbon atoms or a monovalent alkyl silyl group having 1-10 carbon atoms.)

Inventors:
SAEKI AKINORI (JP)
MIYAUCHI TAKUYA (JP)
MIYAZAKI DAICHI (JP)
Application Number:
PCT/JP2019/041645
Publication Date:
May 14, 2020
Filing Date:
October 24, 2019
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G73/10
Domestic Patent References:
WO2013047451A12013-04-04
WO2006082814A12006-08-10
WO2017221776A12017-12-28
Foreign References:
CN105461923A2016-04-06
JPH0436321A1992-02-06
JP2013256666A2013-12-26
JP2015141303A2015-08-03
JPH0291124A1990-03-30
JP2010155895A2010-07-15
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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