Title:
POLYIMIDE PRODUCTION METHOD, POLYIMIDE, POLYIMIDE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/080007
Kind Code:
A1
Abstract:
The present invention pertains to: a polyimide production method comprising a step (1) for obtaining a polyimide by causing a reaction between (b) a diamine and (a) a tetracarboxylic acid and/or a tetracarboxylic acid dianhydride in a temperature range of 80-250°C in a reaction solvent containing 60-100 mass% of water with respect to a total of 100 mass% of the reaction solvent, and a step (2) for performing chain extension of the obtained polyimide; or a polyimide production method comprising a step (3) for obtaining a polyimide by causing a reaction between (e) a diamine having a purity of 98 mass% or more and (d) a tetracarboxylic acid dianhydride having a purity of 98 mass% or more in a temperature range of 100-370°C in a reaction solvent containing 60-100 mass% of water with respect to a total of 100 mass% of the reaction solvent. Provided are: a method that is for producing a polyimide suitable for an interlayer insulation film and a surface protective film for electronic components, etc., and that enables the usage amount of organic solvents to be reduced; said polyimide, a resin composition containing said polyimide; and a cured product formed from the resin composition.
Inventors:
ICHINOSE KEIKO (JP)
AOSHIMA KENTA (JP)
ASANO ITARU (JP)
ARAKI HITOSHI (JP)
AOSHIMA KENTA (JP)
ASANO ITARU (JP)
ARAKI HITOSHI (JP)
Application Number:
PCT/JP2022/039608
Publication Date:
May 11, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G73/10; C08L79/08; G03F7/037
Foreign References:
| JPS4617144B1 | 1971-05-12 | |||
| JP2001270945A | 2001-10-02 | |||
| JP2001181389A | 2001-07-03 | |||
| CN108948352A | 2018-12-07 | |||
| JP2012021133A | 2012-02-02 | |||
| US20190177483A1 | 2019-06-13 |
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