Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYIMIDE RESIN COMPOSITION, AND (POLYIMIDE RESIN)-FIBER COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/020020
Kind Code:
A1
Abstract:
[1] A polyimide resin composition comprising a polyimide resin (A) and an additive (B), wherein the polyimide resin (A) contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2), and the ratio of the content of the repeating constituent unit represented by formula (1) to the total content of the repeating constituent unit represented by formula (1) and the repeating constituent unit represented by formula (2) is 40 to 70 mol%; and [2] a composite material produced by impregnating a fiber material (C) with a polyimide resin (A) which contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2), wherein the ratio of the content of the repeating constituent unit represented by formula (1) to the total content of the repeating constituent unit represented by formula (1) and the repeating constituent unit represented by formula (2) is 40 to 70 mol%. (R1 represents a bivalent group having 6 to 22 carbon atoms and containing at least one alicyclic hydrocarbon structure; R2 represents a bivalent linear aliphatic group having 5 to 20 carbon atoms; and X1 and X2 independently represent a tetravalent group having 6 to 22 carbon atoms and containing at least one aromatic ring.)

More Like This:
JP5564012Thermosetting resin composition for multi-layer printed wiring board, thermosetting adhesive film and multi-layer printed circuit board produced using them
JP5139986Polyimide-based resin composition, its manufacturing method, and metal laminate
JP4177984Encapsulant
Inventors:
SATO YUUKI (JP)
MITADERA JUN (JP)
Application Number:
PCT/JP2014/070533
Publication Date:
February 12, 2015
Filing Date:
August 04, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L79/08; C08G73/10; C08K5/13; C08K5/16; C08K5/36; C08K5/49; C09J179/08; D01F6/74
Foreign References:
JP5365762B12013-12-11
JP2011246726A2011-12-08
JP2009114439A2009-05-28
JP2002206057A2002-07-26
JP2004083814A2004-03-18
JP2005320424A2005-11-17
JP2005028524A2005-02-03
JPH07173300A1995-07-11
JP2013010255A2013-01-17
JP2005249952A2005-09-15
JPH10195195A1998-07-28
JPH09509928A1997-10-07
Other References:
AURUM TECHNICAL INFORMATION/G-06 AURUM INJECTION MOLDING CONDITIONS, 15 January 2004 (2004-01-15), Retrieved from the Internet
MACROMOL. RAPID. COMMUN., vol. 885, 2005, pages 26
"Latest Polyimides - Basics and Applications", August 2010, NTS, pages: 175 - 176
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD FOR PRODUCING POLYIMIDE RESIN POWDER, AND THERMOPLASTIC POLYIMIDE RESIN POWDER

Next Patent: PRODUCT STORING DEVICE