Title:
POLYIMIDE RESIN, RESIN COMPOSITION AND LAMINATED FILM THAT USE SAME
Document Type and Number:
WIPO Patent Application WO/2013/039029
Kind Code:
A1
Abstract:
Provided are: a polyimide film in which volatile matter is not generated due to decomposition etc., and which has good adhesiveness, even at high temperatures of 250°C and above; and a resin composition and a laminated film that use the polyimide film. The polyimide resin is characterized by having at least an acid dianhydride residue and a diamine residue, and a glass transition temperature of not more than 30°C, and is further characterized in that the diamine residue contains a polysiloxane diamine residue represented by general formula (1). (n is a natural number, and has an average value, which is calculated from the average molecular weight of the polysiloxane diamine, of five to thirty. R1 and R2 may be the same or different, and each represents an alkylene group or a phenylene group with one to thirty carbons. R3 to R6 may be the same or different, and each represents an alkyl group, a phenyl group or a phenoxy group with one to thirty carbons.)
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Inventors:
WATANABE TAKUO
LEE CHUNGSEON
LEE CHUNGSEON
Application Number:
PCT/JP2012/073025
Publication Date:
March 21, 2013
Filing Date:
September 10, 2012
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
WATANABE TAKUO
LEE CHUNGSEON
WATANABE TAKUO
LEE CHUNGSEON
International Classes:
C08G73/10; B32B27/34; C09J7/00; C09J179/08; C09J183/08; C09J183/10
Foreign References:
| JPH09183850A | 1997-07-15 | |||
| JPS61203132A | 1986-09-09 | |||
| JP2009091457A | 2009-04-30 | |||
| JP2008308549A | 2008-12-25 | |||
| JP2005105246A | 2005-04-21 | |||
| JPH05200946A | 1993-08-10 | |||
| JP2004277619A | 2004-10-07 |
Other References:
See also references of EP 2735580A4
Download PDF:
Claims:
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