POLYIMIDE RESIN, CURABLE POLYIMIDE RESIN COMPOSITION, AND CURED PRODUCT

WIPO Patent Application WO/2010/074014

A1

Disclosed are a polyimide resin having excellent preservation stability, such as good solubility in a solvent even after long-term storage; a curable polyimide resin composition containing said resin; and a cured product such as a coated film having excellent heat resistance, dimensional stability, and mechanical properties (toughness, flexibility). More specifically, disclosed are a polyimide resin having a structure obtained using 4,4'-diisocyanate-1,1'-biphenyl; a curable polyimide resin composition containing said resin; and a cured product obtained by curing the same. Those can be used, for example, as an electrical insulation material such as a heat-resistant coating material, an interlayer insulation material for a printed wiring board, or a semiconductor insulation material; a buildup material; a prepreg resin; or a heat-resistant adhesive agent.

JP2023055304	POLYAMIDE-IMIDE(METH)ACRYLATE RESIN, ACTIVE ENERGY RAY-CURABLE RESIN COMPOSITION USING THE SAME AND CURED PRODUCT OF THE SAME
JP5109374	Polyamideimide resin solution and its production method, resin composition and coating composition
WO/1990/007548	VINYLIC RESIN COMPOSITION

ICHINOSE EIJU (JP)
ITO SATOKO (JP)
UNO SEIICHI (JP)
MURAKAMI KOUICHI (JP)

PCT/JP2009/071204

July 01, 2010

December 21, 2009

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DAINIPPON INK & CHEMICALS (JP)
ICHINOSE EIJU (JP)
ITO SATOKO (JP)
UNO SEIICHI (JP)
MURAKAMI KOUICHI (JP)

C08G73/14; C08G18/42; C08L61/28; C08L63/00; C08L79/08

WO2008072495A1	2008-06-19
WO2007108472A1	2007-09-27

JP2007204714A	2007-08-16
JP2008144161A	2008-06-26
JPH0559174A	1993-03-09
JP2008285660A	2008-11-27
JP2007099956A	2007-04-19

KONO MICHIHIRO (JP)
Michihiro Kono (JP)

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