Title:
POLYIMIDE RESIN AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2017/051783
Kind Code:
A1
Abstract:
A polyimide resin including a structural unit shown by formula (1-1), and a polyimide film including a structural unit shown by formula (1-2) and having a thickness of 10-50 μm. (In formula (1-1), R1 and R2 are each independently a group of any of formulas (i)-(iv); in formula (1-2), R1 and R2 are each independently a group of formula (i) or formula (ii); * in these formulas bonds to carbons marked with an * in formula (1-1) and formula (1-2), and ** bonds to carbons marked with an ** in formula (1-1) and formula (1-2).) Provided are a polyimide resin that makes it possible to form a polyimide film having excellent transparency and a low coefficient of linear thermal expansion, and a polyimide film having a lower coefficient of linear thermal expansion.
Inventors:
MATSUMARU TERUHISA (JP)
SUENAGA SHUYA (JP)
ABIKO YOHEI (JP)
SUENAGA SHUYA (JP)
ABIKO YOHEI (JP)
Application Number:
PCT/JP2016/077562
Publication Date:
March 30, 2017
Filing Date:
September 16, 2016
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; B32B27/34; C08J5/18
Domestic Patent References:
| WO2012124664A1 | 2012-09-20 | |||
| WO2015122032A1 | 2015-08-20 | |||
| WO2000013058A1 | 2000-03-09 |
Other References:
See also references of EP 3354676A4
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD
Next Patent: MOTOR AND ROTATING PROPELLER DEVICE
Next Patent: MOTOR AND ROTATING PROPELLER DEVICE