Title:
POLYIMIDE RESIN LAMINATE FILM
Document Type and Number:
WIPO Patent Application WO/2007/037192
Kind Code:
A1
Abstract:
Disclosed is a polyimide resin laminate film which is improved in the occurrence of wrinkling and meandering during the continuous thermal lamination of the polyimide resin laminate film and a metal foil. Also disclosed is a flexible metal-clad laminate manufactured using a polyimide film laminate. The polyimide resin laminate film has at least two different polyimide layers and has a film width of 490 mm or more and a thickness of 10 to 50 μm inclusive. The laminate film shows the maximum amount of sagging of 18 mm or less under a load of 1.7 kg/0.51 m.
Inventors:
ONO KAZUHIRO (JP)
FUJIHARA KAN (JP)
FUJIHARA KAN (JP)
Application Number:
PCT/JP2006/318934
Publication Date:
April 05, 2007
Filing Date:
September 25, 2006
Export Citation:
Assignee:
KANEKA CORP (JP)
ONO KAZUHIRO (JP)
FUJIHARA KAN (JP)
ONO KAZUHIRO (JP)
FUJIHARA KAN (JP)
International Classes:
B32B27/34; B32B15/088; H05K1/03
Foreign References:
| JP2005186274A | 2005-07-14 | |||
| JP2004346210A | 2004-12-09 | |||
| JPH05327147A | 1993-12-10 |
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi, Osaka 88, JP)
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