Title:
POLYIMIDE RESIN, METAL LAMINATE USING SAME, AND PRINTED CIRCUIT BOARD INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2017/111343
Kind Code:
A1
Abstract:
The present invention relates to a polyimide resin, a metal laminate using the same, and a printed circuit board including the same, wherein the polyimide resin has an excellent thermal conductivity. Therefore, the present invention can provide a printed circuit board having an improved heat radiating property.
Inventors:
JEONG JISOO (KR)
KIM WONKYUM (KR)
JEONG INKI (KR)
KIM WONKYUM (KR)
JEONG INKI (KR)
Application Number:
PCT/KR2016/014115
Publication Date:
June 29, 2017
Filing Date:
December 02, 2016
Export Citation:
Assignee:
DOOSAN CORP (KR)
International Classes:
C08L79/08; B32B15/08; B32B27/28; C08G73/10; C08K3/22; C08K3/28; C08K3/38; H05K3/00
Foreign References:
| JP2010084072A | 2010-04-15 | |||
| JP2011063647A | 2011-03-31 | |||
| US20130189514A1 | 2013-07-25 | |||
| KR101548877B1 | 2015-09-01 | |||
| KR20090061567A | 2009-06-16 |
Attorney, Agent or Firm:
HANBEOT PATENT & LAW FIRM (KR)
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