Title:
POLYIMIDE RESIN, METHOD FOR PRODUCING POLYIMIDE RESIN, POLYIMIDE RESIN SOLUTION, COATING MATERIAL, AND MOLDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/191017
Kind Code:
A1
Abstract:
Provided is a polyimide resin excelling in solubility in a solvent, mechanical characteristics, and electrical characteristics. The polyimide resin is obtained by polymerizing a diamine component and an acid component. In the diamine component, a diamine compound A represented by formula (A) below accounts for 30.0-93.0 mol%, and 4,4'-oxydianiline accounts for 7.0-65.0 mol%, and in the acid component, pyromellitic dianhydride accounts for 1.0-70.0 mol%, and 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride accounts for 23.0-92.0 mol%. In formula (A), R1, R2, R3 and R4 each represent hydrogen or an organic group having 1-4 carbons, and R1 and R2 may form a closed ring.
Inventors:
KOBAYASHI MASANORI (JP)
OGURA TAKEHITO (JP)
OGURA TAKEHITO (JP)
Application Number:
PCT/JP2022/009023
Publication Date:
September 15, 2022
Filing Date:
March 03, 2022
Export Citation:
Assignee:
JFE CHEMICAL CORP (JP)
International Classes:
C08G73/10
Domestic Patent References:
WO2010044381A1 | 2010-04-22 |
Foreign References:
JP2006509888A | 2006-03-23 | |||
JPS59219330A | 1984-12-10 | |||
US4830953A | 1989-05-16 | |||
JP2015209455A | 2015-11-24 | |||
JP2015209461A | 2015-11-24 | |||
JPH0641815A | 1994-02-15 | |||
JP5027514B2 | 2012-09-19 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF:
Previous Patent: RESIN COMPOSITION FOR BACK-SURFACE LAYER AND HEAT-SENSITIVE TRANSFER RECORDING MATERIAL
Next Patent: ENERGIZING MEMBER AND HEATER
Next Patent: ENERGIZING MEMBER AND HEATER