Title:
POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, METAL-CLAD LAMINATED BOARD, LAMINATE, AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/085398
Kind Code:
A1
Abstract:
This polyimide resin precursor is obtained by reacting a diamine and an acid anhydride. The diamine includes p-phenylenediamine, bis(aminophenoxy)benzene, and 2-(4-aminophenyl)benzoxazole-5-amine. The acid anhydride includes phenyltetracarboxylic dianhydride. In relation to the entire diamine, the p-phenylenediamine content is 30-75 mol%, the bis(aminophenoxy)benzene content is 10-30 mol%, and the 2-(4-aminophenyl)benzoxazole-5-amine content is 10-50 mol%. In relation to the entire acid anhydride, the phenyltetracarboxylic dianhydride content is 78 mol% or greater.
Inventors:
SATO YOSHINORI (JP)
MATSUYAMA HIROYUKI (JP)
KONNO YOSHIHIKO (JP)
MATSUYAMA HIROYUKI (JP)
KONNO YOSHIHIKO (JP)
Application Number:
PCT/JP2021/036515
Publication Date:
April 28, 2022
Filing Date:
October 01, 2021
Export Citation:
Assignee:
ARISAWA SEISAKUSHO KK (JP)
International Classes:
C08G73/10; B32B15/088; B32B27/34; H05K1/03
Foreign References:
| JP2018150544A | 2018-09-27 | |||
| JP2012233198A | 2012-11-29 | |||
| JP2005304207A | 2005-10-27 | |||
| JP2018028076A | 2018-02-22 | |||
| JP2018024932A | 2018-02-15 |
Attorney, Agent or Firm:
KIMURA Mitsuru et al. (JP)
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