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Patent Searching and Data


Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2019/065523
Kind Code:
A1
Abstract:
This polyimide resin contains constituent units A derived from a tetracarboxylic acid dianhydride and constituent units B derived from a diamine, wherein constituent units A include constituent units (A-1) derived from a compound represented by formula (a-1) and constituent units (A-2) derived from a compound represented by formula (a-2), and constituent units B include constituent units (B-1) derived from a compound represented by formula (b-1) and constituent units (B-2) derived from a compound represented by formula (b-2). (In formula (a-2), L is a single bond or a divalent linking group, and in formula (b-2), the R groups each independently represent a hydrogen atom, a fluorine atom or a methyl group.)

Inventors:
ABIKO YOHEI (JP)
SATO SAEKO (JP)
DAITO AOI (JP)
SEKIGUCHI SHINJI (JP)
Application Number:
PCT/JP2018/035129
Publication Date:
April 04, 2019
Filing Date:
September 21, 2018
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08K5/00; C08L79/08
Domestic Patent References:
WO2013179727A12013-12-05
WO2015053312A12015-04-16
WO2015152178A12015-10-08
WO2016084777A12016-06-02
Foreign References:
JP2016204569A2016-12-08
JP2016204568A2016-12-08
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
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