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Patent Searching and Data


Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2019/116940
Kind Code:
A1
Abstract:
A polyimide resin which has a constituent unit A that is derived from a tetracarboxylic acid dianhydride and a constituent unit B that is derived from a diamine, and wherein: the constituent unit A contains a constituent unit (A-1) that is derived from a compound represented by formula (a-1), a constituent unit (A-2) that is derived from a compound represented by formula (a-2) and a constituent unit (A-3) that is derived from a compound represented by formula (a-3); and the constituent unit B contains a constituent unit (B-1) that is derived from a compound represented by formula (b-1). A polyimide varnish and a polyimide film, each of which contains this polyimide resin.

Inventors:
ABIKO YOHEI (JP)
SEKIGUCHI SHINJI (JP)
TAKADA TAKAFUMI (JP)
Application Number:
PCT/JP2018/044368
Publication Date:
June 20, 2019
Filing Date:
December 03, 2018
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
WO2017191822A12017-11-09
WO2015002273A12015-01-08
WO2015122032A12015-08-20
WO2011099518A12011-08-18
WO2018066522A12018-04-12
Foreign References:
JP2016204568A2016-12-08
JP2018172669A2018-11-08
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
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