POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM

Title:

POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM

Document Type and Number:

WIPO Patent Application WO/2021/006284

Kind Code:

A1

Abstract:

This polyimide resin has structural unit A derived from a tetracarboxylic acid di-anhydride and structural unit B derived from a diamine, wherein the structural unit A includes structural unit (A-1) derived from a compound represented by formula (a-1) but does not include structural unit (A-2) derived from a compound represented by formula (a-2), the structural unit B includes structural unit (B-1) derived from a compound represented by formula (b-1) and structural unit (B-2) derived from a compound represented by formula (b-2), the proportion of structural unit (B-1) in structural unit B is 30-70 mol%, and the proportion of structural unit (B-2) in structural unit B is 70-30 mol%.

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Inventors:

HOSHINO SHUN (JP)
MITADERA JUN (JP)

Application Number:

PCT/JP2020/026619

Publication Date:

January 14, 2021

Filing Date:

July 08, 2020

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)

International Classes:

C08G73/10

Domestic Patent References:

WO2016158825A1

2016-10-06

Foreign References:

JP2010116476A	2010-05-27
JP2008297360A	2008-12-11
JP2018131601A	2018-08-23

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

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