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Patent Searching and Data


Title:
POLYIMIDE RESIN, VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2023/085041
Kind Code:
A1
Abstract:
This polyimide resin contains constituent units A derived from a tetracarboxylic acid dianhydride and constituent units B derived from a diamine. Constituent units A include: at least one type of constituent unit (A1) selected from the group consisting of constituent units (A11) derived from a compound represented by formula (a11) and constituent units (A12) derived from a compound represented by formula (a12); and constituent units (A2) derived from a compound represented by formula (a2). Constituent units B include constituent units (B1) derived from a compound represented by formula (b1).

Inventors:
ABIKO YOHEI (JP)
ISHII KENTARO (JP)
MURAYA TAKAHIRO (JP)
Application Number:
PCT/JP2022/039210
Publication Date:
May 19, 2023
Filing Date:
October 21, 2022
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08K5/3445; C08L79/08
Domestic Patent References:
WO2018097142A12018-05-31
WO2018097143A12018-05-31
WO2021132197A12021-07-01
WO2019188265A12019-10-03
WO2018042999A12018-03-08
WO2014038715A12014-03-13
WO2014208704A12014-12-31
WO2019009259A12019-01-10
Foreign References:
JP2011216535A2011-10-27
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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