Title:
POLYIMIDE, POLYIMIDE SOLUTION COMPOSITION, POLYIMIDE FILM, AND SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/131896
Kind Code:
A1
Abstract:
Provided is a polyimide comprising more than 50 mol% of a repeating unit represented by chemical formula (1) with respect to total repeating units, the polyimide having, when measured as a 10 μm-thick film, a thermal expansion coefficient of 25 ppm/K or less between 100 and 250 °C inclusive, and a transmittance of at least 80% at wavelength 400 nm.
Inventors:
OKA TAKUYA (JP)
KOHAMA YUKINORI (JP)
NAKAGAWA MIHARU (JP)
HISANO NOBUHARU (JP)
KOHAMA YUKINORI (JP)
NAKAGAWA MIHARU (JP)
HISANO NOBUHARU (JP)
Application Number:
PCT/JP2018/048210
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
International Classes:
C08G73/10; B32B17/10; B32B27/34; C08J5/18; H05K1/03
Domestic Patent References:
| WO2016153064A1 | 2016-09-29 | |||
| WO2018066522A1 | 2018-04-12 |
Foreign References:
| JP2016132686A | 2016-07-25 | |||
| JP2018188373A | 2018-11-29 |
Attorney, Agent or Firm:
ITO, Katsuhiro (JP)
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