Title:
POLYMER, COMPOSITION, MOLDED ARTICLE, CURED PRODUCT, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/020981
Kind Code:
A1
Abstract:
Provided are: a novel polymer which has a high glass transition temperature, superior solubility in various organic solvents, superior heat resistance, and superior mechanical properties; and a composition, a molded article, a cured product, and a laminate which use the polymer. The polymer according to the present invention is characterized by having a first structural unit represented by formula (1), a second structural unit represented by formula (2-1) and/or formula (2-2), and a third structural unit represented by formula (3-1) and/or formula (3-2).
Inventors:
ANABUKI SHOUMA (JP)
HIFUMI RYOUYUU (JP)
KADOTA TOSHIAKI (JP)
TATARA RYOUJI (JP)
MIYAKI NOBUYUKI (JP)
HIFUMI RYOUYUU (JP)
KADOTA TOSHIAKI (JP)
TATARA RYOUJI (JP)
MIYAKI NOBUYUKI (JP)
Application Number:
PCT/JP2017/024866
Publication Date:
February 01, 2018
Filing Date:
July 06, 2017
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C08G63/19; B32B27/38
Domestic Patent References:
| WO2016152295A1 | 2016-09-29 | |||
| WO2016163462A1 | 2016-10-13 |
Foreign References:
| JPS5838721A | 1983-03-07 | |||
| JPS6119627A | 1986-01-28 | |||
| JPH04268325A | 1992-09-24 | |||
| JPH07179579A | 1995-07-18 | |||
| JPH09136967A | 1997-05-27 | |||
| JP2009167291A | 2009-07-30 | |||
| JP2010083986A | 2010-04-15 | |||
| JP2011068798A | 2011-04-07 | |||
| JP2013173928A | 2013-09-05 | |||
| JP2014031401A | 2014-02-20 | |||
| JP2011068798A | 2011-04-07 | |||
| JP2009167291A | 2009-07-30 | |||
| JP2013173928A | 2013-09-05 | |||
| JPH06306152A | 1994-11-01 |
Other References:
"Demonstration of 20 ani Pitch Micro-vias by Excimer Laser Ablation in Ultra-thin Dry-film Polymer Dielectrics for Multi-layer RDL on Glass Interposers", IEEE ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2015, pages 922 - 927
"Demonstration of Enhanced System-level Reliability of Ultra-thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2016, pages 1377 - 1385
"Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2016, pages 1297 - 1302
"Design, Demonstration and Characterization of Ultra-thin Low-warpage Glass BGA Packages for Smart Mobile Application Processo", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2016, pages 1465 - 1470
"Design and Demonstration of Ultra-thin Glass 3D IPD Diplexers", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2016, pages 2348 - 2352
See also references of EP 3492510A4
"Demonstration of Enhanced System-level Reliability of Ultra-thin BGA Packages with Circumferential Polymer Collars and Doped Solder Alloys", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2016, pages 1377 - 1385
"Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2016, pages 1297 - 1302
"Design, Demonstration and Characterization of Ultra-thin Low-warpage Glass BGA Packages for Smart Mobile Application Processo", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2016, pages 1465 - 1470
"Design and Demonstration of Ultra-thin Glass 3D IPD Diplexers", IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2016, pages 2348 - 2352
See also references of EP 3492510A4
Attorney, Agent or Firm:
OFUCHI, Michie et al. (JP)
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