ALKOXYSILANE/ORGANIC POLYMER COMPOSITION FOR THIN INSULATING FILM PRODUCTION AND USE THEREOF

Title:

ALKOXYSILANE/ORGANIC POLYMER COMPOSITION FOR THIN INSULATING FILM PRODUCTION AND USE THEREOF

Document Type and Number:

WIPO Patent Application WO/1999/003926

Kind Code:

A1

Abstract:

An alkoxysilane/organic polymer composition for the production of thin insulating films which comprises (A) a specific alkoxysilane, (B) a specific organic polymer, and (C) a solvent which is for the alkoxysilane (A) and the organic polymer (B) and comprises an organic solvent having an amide group and/or an ester group; a thin insulating film of a silica/organic polymer composite obtained by forming the composition into a thin film, subjecting the alkoxysilane in the thin film to hydrolysis and condensation with dehydration to cause the alkoxysilane to gel, and removing the solvent remaining in the film; and a thin porous silica film obtained from the thin composite film by removing the organic polymer therefrom. The two films not only have a low permittivity and are suitable for use as an insulating layer for a multilayer wiring structure of a semiconductor element, but also can be produced by a method easily practicable in current semiconductor element production processes.

Inventors:

IOKA TAKAAKI (JP)
TANABE TSUNEAKI (JP)

Application Number:

PCT/JP1998/003186

Publication Date:

January 28, 1999

Filing Date:

July 15, 1998

Export Citation:

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Assignee:

ASAHI CHEMICAL IND (JP)
IOKA TAKAAKI (JP)
TANABE TSUNEAKI (JP)

International Classes:

B32B27/00; C08J5/18; C08K5/10; C09D183/02; C09D183/12; C09D183/14; H01L21/312; H01L21/316; H01L21/768; C08L83/04; H05K1/00; (IPC1-7): C08L83/04; C08L67/02; C08L69/00; C08L71/02; C08K5/10; C08K5/20; C08J5/18; C08J9/26; B32B27/00; C01B33/12; H01L21/3205; H01L21/316

Foreign References:

JPH08245278A	1996-09-24
JPH07100389A	1995-04-18

Other References: