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Title:
POLYMER COMPOSITION WITH REDUCED DIELECTRIC CONSTANT
Document Type and Number:
WIPO Patent Application WO/2019/213920
Kind Code:
A1
Abstract:
A polymer composition contains special fillers for plastic dielectrical and other properties adjustment. In general, the composition contains a base resin and a polymeric filler, such as a polyethylene (e.g., ultrahigh molecular weight polyethylene). The polymeric filler may reduce the dielectric constant of the base resin, the dissipation factor of the base resin, or both.

Inventors:
PENG, Xiangbing (22-303, Lane 300 East Shenmei RD.,Pudong New Area, Shanghai 8, 201318, CN)
WANG, Min (Room 201, No. 109 Lane 3088,Jinxiu Road, Pudong, Shanghai 5, 200125, CN)
YUAN, Xiang (Room 301, No. 57 Lane 1359,Jinyuanyi Road, Jiading, Shanghai 0, 201800, CN)
Application Number:
CN2018/086389
Publication Date:
November 14, 2019
Filing Date:
May 10, 2018
Export Citation:
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Assignee:
TICONA LLC (8040 Dixie Highway, Florence, KY, 41042, US)
PENG, Xiangbing (22-303, Lane 300 East Shenmei RD.,Pudong New Area, Shanghai 8, 201318, CN)
WANG, Min (Room 201, No. 109 Lane 3088,Jinxiu Road, Pudong, Shanghai 5, 200125, CN)
YUAN, Xiang (Room 301, No. 57 Lane 1359,Jinyuanyi Road, Jiading, Shanghai 0, 201800, CN)
International Classes:
C08L81/02; C08K7/14; C08L67/02; H01B3/00; H01Q1/38; H05K5/02
Domestic Patent References:
WO2016101692A12016-06-30
WO2017115757A12017-07-06
Foreign References:
JP2013131576A2013-07-04
JP2013131576A2013-07-04
CN101127257A2008-02-20
Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (8th Floor, Vantone New World Plaza2 Fuchengmenwai Street, Xicheng District, Beijing 7, 100037, CN)
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