Title:
POLYMER COMPOUND AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/121292
Kind Code:
A1
Abstract:
The present invention relates to: a polymer compound capable of modifying the surface of an inorganic nanopowder through chemical bonding to the surface; and an application thereof, and, more specifically, to a polymer compound and an application thereof, the polymer compound readily and rapidly chemically bonding to the surface of an inorganic nanoparticle powder so as to modify the surface of the inorganic nanoparticle and form a polymer coating layer, and being economically and efficiently prepared.
Inventors:
JANG SEUNG HYUN (KR)
KIM MIN JUNG (KR)
OH CHUN RIM (KR)
LEE WON JUNG (KR)
LEE CHI WAN (KR)
KIM MIN JUNG (KR)
OH CHUN RIM (KR)
LEE WON JUNG (KR)
LEE CHI WAN (KR)
Application Number:
PCT/KR2022/020960
Publication Date:
June 29, 2023
Filing Date:
December 21, 2022
Export Citation:
Assignee:
SAMYANG CORP (KR)
International Classes:
C08F230/08; A61K8/02; A61K8/29; A61K8/89; A61Q1/00; A61Q17/04; A61Q19/00; C08F220/18; C08F230/02
Foreign References:
| JPH06313009A | 1994-11-08 | |||
| KR20140069916A | 2014-06-10 | |||
| JPH09327288A | 1997-12-22 | |||
| JPH07118123A | 1995-05-09 | |||
| JP2005126329A | 2005-05-19 |
Attorney, Agent or Firm:
HANSUNG INTELLECTUAL PROPERTY (KR)
Download PDF: