Title:
POLYMER COMPOUND, COMPOSITION FOR MOLDING, FILM, AND CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2023/033142
Kind Code:
A1
Abstract:
Provided is a polymer compound having a high dielectric constant. This polymer compound has a constituent unit (U) having a heterocyclic ring, a carbonyl group, and a substituent group bonded to the heterocyclic ring. The substituent group includes at least one type selected from the group consisting of a halogen group, a hydroxyl group, an aldehyde group, a carboxyl group, an alkyl group, a halogenated alkyl group and a hydroxyalkyl group.
Inventors:
OGIHARA YUSUKE
Application Number:
PCT/JP2022/033099
Publication Date:
March 09, 2023
Filing Date:
September 02, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G63/06; C08G61/12; C08J5/18
Domestic Patent References:
| WO2021095640A1 | 2021-05-20 |
Foreign References:
| JP2021503516A | 2021-02-12 | |||
| JP2015072440A | 2015-04-16 | |||
| JP2014504654A | 2014-02-24 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
Download PDF:
Previous Patent: OPTICAL DEVICE, AND METHOD FOR DISASSEMBLING OPTICAL DEVICE
Next Patent: FLUID CONTROL VALVE
Next Patent: FLUID CONTROL VALVE