POLYMER EMULSION, AND SINGLE-LIQUID TYPE THERMOSETTING RESIN COMPOSITION, TWO-LIQUID TYPE THERMOSETTING RESIN COMPOSITION, COATING MATERIAL, RESIN CURED FILM, AND COATING FILM USING SAID POLYMER EMULSION

WIPO Patent Application WO/2024/034518

A1

Provided are: a polymer emulsion having excellent preservation stability; and a thermosetting resin composition and the like that contain said polymer emulsion and that have excellent curability at a low temperature.　The present invention contains a polymer emulsion (B) that contains water and a polymer (A) including a structural unit (A-1) represented by formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, R2 represents a linear or branched aliphatic saturated hydrocarbon group having 1-20 carbon atoms and a valence of 2-4, and optionally having an ether bond, or an aromatic hydrocarbon group or an alicyclic hydrocarbon group having 6-20 carbon atoms and a valence of 2, and optionally having a urethane bond, R3 represents a hydrogen atom, an alkyl group having 1-10 carbon atoms, or a cycloalkyl group or an arylalkyl group having 6-20 carbon atoms, R4 represents a hydrogen atom, an alkyl group having 1-10 carbon atoms, or a cycloalkyl group or an arylalkyl group having 6-20 carbon atoms, and n represents 1 or 2.]

SEKIOKA NAOKI (JP)

PCT/JP2023/028448

February 15, 2024

August 03, 2023

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RESONAC CORP (JP)

C08F220/36; C08L33/14; C09D5/02; C09D133/14; C09D175/04

JP2003041185A	2003-02-13
JPH03119076A	1991-05-21
JP6240147B2	2017-11-29
JPH05273799A	1993-10-22
JPH05197169A	1993-08-06

SSINPAT PATENT FIRM (JP)

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