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Title:
POLYMER FILM AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/113973
Kind Code:
A1
Abstract:
Provided are a polymer film that exhibits an excellent adhesiveness to substrate, and a laminate that uses the polymer film. The polymer film comprises a polymer having a dielectric loss tangent of less than or equal to 0.005 and a functional group-bearing compound, and the concentration of the functional group-bearing compound is higher at at least one surface than in the interior.

Inventors:
SASADA YASUYUKI (JP)
Application Number:
PCT/JP2021/042909
Publication Date:
June 02, 2022
Filing Date:
November 24, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L101/02; B32B7/025; C08J5/18; C08K3/22; H05K1/03
Domestic Patent References:
WO2018163999A12018-09-13
WO2013065453A12013-05-10
WO2015064437A12015-05-07
WO2018181726A12018-10-04
Foreign References:
JPH10258491A1998-09-29
JP2017031442A2017-02-09
JP2017047686A2017-03-09
JP2005539382A2005-12-22
JP2007055054A2007-03-08
JP2012140552A2012-07-26
JP2016079354A2016-05-16
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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