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Patent Searching and Data


Title:
POLYMER FILM, MULTILAYER BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/163776
Kind Code:
A1
Abstract:
A polymer film which has a layer A and a layer B that is arranged on at least one surface of the layer A, wherein: the layer A contains a polymer having a dielectric loss tangent of 0.01 or less, or at least one polymer A that is selected from the group consisting of a liquid crystalline polymer, a fluorine polymer, a polymerization product of a compound that comprises a cycloaliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether and an aromatic polyether ketone; the layer B contains an additive; and the layer B has an inflection point in the elastic modulus change due to temperature change or deformation rate change, or alternatively, the layer B is decreased in the elastic modulus when a pressure is applied thereto. A multilayer body which uses this polymer film; and a method for producing this multilayer body.

Inventors:
SASADA YASUYUKI (JP)
MOROOKA NAOYUKI (JP)
Application Number:
PCT/JP2022/003167
Publication Date:
August 04, 2022
Filing Date:
January 27, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B7/022; B32B7/025; B32B15/08; H05K1/03; H05K3/46; C08G63/02; C08L67/00; C08L77/12; C08L101/00; C08L101/12
Domestic Patent References:
WO2021100277A12021-05-27
Foreign References:
JP2015002334A2015-01-05
JP2010238990A2010-10-21
JP2009110988A2009-05-21
JPH05226796A1993-09-03
JP2021160148A2021-10-11
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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