POLYMER FILM RELEASING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND RELEASING DEVICE

WIPO Patent Application WO/2022/230505

A1

Provided is a releasing method that, without affecting the quality of an electronic device formed on a surface of a polymer film, can easily release the polymer film from an inorganic substrate.　Provided is a method for releasing a first polymer film, characterized by including: a step A in which a layered body is prepared by adhering, to each other, an inorganic substrate and a first polymer film on which an electronic device has been formed; a step B1 in which the first polymer film side of the layered body is placed and fixed so as to be in contact with a vacuum suction plate, a partition wall is provided on a side surface of the layered body, and a second polymer film that is larger than the inorganic substrate is layered onto the inorganic substrate side of the layered body, so as to provide an enclosed space formed by the vacuum suction plate, the second polymer film, and the partition wall; and a step C in which a releasing portion is provided between the first polymer film and the inorganic substrate of the layered body and air is injected into this releasing portion to release the first polymer film while keeping same approximately level.

OKUYAMA TETSUO (JP)
TSURUNO YOSHIHIRO (JP)

PCT/JP2022/014586

November 03, 2022

March 25, 2022

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TOYO BOSEKI (JP)

B29C69/00; B65H41/00; H01L21/02; H01L21/301; H01L21/683

WO2022009451A1

2022-01-13

JP2021027130A	2021-02-22
JP2013504178A	2013-02-04
JP2015202674A	2015-11-16
JPH10125931A	1998-05-15
JP2018199163A	2018-12-20
JP2015038001A	2015-02-26

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