Title:
POLYMER FILM
Document Type and Number:
WIPO Patent Application WO/2014/193146
Kind Code:
A1
Abstract:
The present invention relates to a polymer film comprising: a base film layer which comprises a polyamide-based resin having a predetermined relative viscosity and a copolymer comprising predetermined contents of polyether-based segments and polyamide-based segments; and an adhesive layer formed on at least one surface of the base film layer, wherein the ratio of the melt viscosity of the copolymer to that of the polyamide-based resin at a shear rate of 1000 s-1 and a temperature of 260℃ is between 0.65 and 1.2.
Inventors:
JEONG YOUNG-HAN (KR)
KWON SO-YEON (KR)
CHUNG IL (KR)
NAMGOONG HYUN (KR)
KWON SO-YEON (KR)
CHUNG IL (KR)
NAMGOONG HYUN (KR)
Application Number:
PCT/KR2014/004729
Publication Date:
December 04, 2014
Filing Date:
May 27, 2014
Export Citation:
Assignee:
KOLON INC (KR)
International Classes:
C09J7/02; B60C5/14; C08J5/18; C08J7/043; C08J7/046
Foreign References:
| KR20130035975A | 2013-04-09 | |||
| KR20050088660A | 2005-09-07 | |||
| KR20020052509A | 2002-07-04 | |||
| KR20110120885A | 2011-11-04 | |||
| KR20010038924A | 2001-05-15 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (Gangnam-gu, Seoul 135-080, KR)
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