Title:
POLYMER, LEVELER AND PREPARATION METHOD THEREFOR, ELECTROPLATING SOLUTION AND ELECTROPLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/051756
Kind Code:
A1
Abstract:
Disclosed in the present application are a polymer, a leveler and a preparation method therefor, an electroplating solution, and an electroplating method, belonging to the technical field of electroplating. The polymer comprises multiple repeating units, the repeating units comprising: a binary epoxy compound residue group and a nitrogen-containing group; the binary epoxy compound residue group is a residue formed after an epoxy ring of a binary epoxy compound is opened; the nitrogen-containing group comprises: an alkyl group, a dimethylamine group and a nitrogen-containing heterocyclic group being connected to two ends of the alkyl group respectively; the dimethylamine group also being connected to the binary epoxy compound residue group by means of a single bond. The present polymer is beneficial for obtaining a highly coplanar coating at a high current density, and is especially suitable as a leveler in an electroplating solution.
Inventors:
ZHENG LI (CN)
LUO JIYE (CN)
TAN BAIZHAO (CN)
LUO JIYE (CN)
TAN BAIZHAO (CN)
Application Number:
PCT/CN2022/123097
Publication Date:
April 06, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
C08G73/00; C08G59/00; C25D5/02
Foreign References:
| CN106435660A | 2017-02-22 | |||
| CN106435662A | 2017-02-22 | |||
| CN104744693A | 2015-07-01 | |||
| CN103103584A | 2013-05-15 | |||
| CN102250319A | 2011-11-23 | |||
| CN108602952A | 2018-09-28 | |||
| CN102276796A | 2011-12-14 | |||
| CN102304218A | 2012-01-04 |
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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