Title:
POLYMER MOLDED BODY COMPRISING BASE PART AND SURFACE LAYER PART
Document Type and Number:
WIPO Patent Application WO/2023/204293
Kind Code:
A1
Abstract:
Provided is a polymer molded body which comprises a base part and a surface layer part thermally adhered onto the base part, and satisfies the following requirements (1) and (2): (1) Gs > Gb (wherein Gs represents the stiffness of the surface layer part, and Gb represents the stiffness of the base part); and (2) Tms < Tp (wherein Tms represents a melting point of the surface layer part at the joint with the base part, and Tp represents a molding temperature in the above-mentioned thermal adhesion).
Inventors:
NAKAJIMA TAKESHI (JP)
KATAGIRI AKIHIRO (JP)
KAMIMURA WAKAKO (JP)
KATAGIRI AKIHIRO (JP)
KAMIMURA WAKAKO (JP)
Application Number:
PCT/JP2023/015876
Publication Date:
October 26, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
SUNALLOMER LTD (JP)
International Classes:
B32B27/00; B29C45/14; B32B27/32
Foreign References:
| JP2015163479A | 2015-09-10 | |||
| JPS5579139A | 1980-06-14 | |||
| JP2013103369A | 2013-05-30 | |||
| JP2017045567A | 2017-03-02 | |||
| JP2021091115A | 2021-06-17 |
Attorney, Agent or Firm:
YAMAMOTO, Osamu et al. (JP)
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