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Patent Searching and Data


Title:
POLYMER, MOLDING MATERIAL AND RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2016/152310
Kind Code:
A1
Abstract:
The present invention relates to: a polymer which is characterized by having a repeating unit represented by formula (1); a molding material which contains this polymer; and a resin molded body which is obtained by molding this molding material. In the formula, each of X1 and X2 independently represents an oxygen atom or a chemical single bond; each of r1-r3 independently represents a hydrogen atom or an alkyl group having 1-6 carbon atoms; Y represents a monovalent group having a specific composition; and each of n1 and n2 independently represents an integer of 1-4. The present invention provides: a novel polymer which is useful as a resin component for molded bodies for optical use; a molding material which contains this polymer; and a resin molded body which is obtained by molding this molding material.

Inventors:
HOUKAWA TAKASHI (JP)
KOMATSUBARA TAKUYA (JP)
FUJII KENSAKU (JP)
SHIMIZU YASUHIRO (JP)
NAMIKOSHI TAKESHI (JP)
WATANABE SHINJI (JP)
MURATA MIKI (JP)
Application Number:
PCT/JP2016/054203
Publication Date:
September 29, 2016
Filing Date:
February 12, 2016
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
C08F16/10
Foreign References:
JP2005113049A2005-04-28
JP2005187703A2005-07-14
JP2010032627A2010-02-12
JP2010174128A2010-08-12
JPH06107729A1994-04-19
JP2010077331A2010-04-08
JP2005023049A2005-01-27
Other References:
See also references of EP 3284760A4
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
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