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Patent Searching and Data


Title:
POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/141528
Kind Code:
A1
Abstract:
This polymer contains a structural unit represented by formula (1a) and a structural unit represented by formula (1b). (In formula (1a), n is 0, 1 or 2. R1, R2, R3 and R4 each independently represent hydrogen or a C1-10 organic group, and at least one of R1, R2, R3 and R4 is an organic group which has an oxetane ring, an epoxy ring, or a carboxyl group. In formula (1b), R5 and R6 each independently represent a C1-10 alkyl group.)

Inventors:
ONISHI OSAMU (JP)
IKEDA HARUO (JP)
Application Number:
PCT/JP2015/057031
Publication Date:
September 24, 2015
Filing Date:
March 10, 2015
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08F232/00; G03F7/023; G03F7/038
Foreign References:
US20060188806A12006-08-24
US20020015912A12002-02-07
JP2015007770A2015-01-15
JP2015064576A2015-04-09
JP2003313177A2003-11-06
JP2008062481A2008-03-21
Attorney, Agent or Firm:
HAYAMI SHINJI (JP)
Shinji Hayami (JP)
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