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Patent Searching and Data


Title:
POLYMER AND POSITIVE RESIST COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/132724
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polymer which can satisfactorily be used as a positive resist with high sensitivity, and a positive resist composition which can satisfactorily form a resist film with excellent sensitivity. This polymer contains α-methylstyrene units and α-chloro-methyl acrylate units, and the proportion of components that have a molecular weight of more than 80000 is 6.0% or less. Further, this positive resist composition contains said polymer and a solvent.

Inventors:
HOSHINO MANABU (JP)
Application Number:
PCT/JP2016/000769
Publication Date:
August 25, 2016
Filing Date:
February 15, 2016
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
C08F212/06; C08F220/22; G03F7/039; G03F7/20
Foreign References:
JPS63137227A1988-06-09
JPH03132760A1991-06-06
Other References:
KATSUYA OKUBO ET AL.: "Cho Bisai Kako-yo Denshisen Polymer Resist no Kaihatsu to Hyoka", POLYMER MATERIAL FORUM KOEN YOKOSHU, vol. 21, 2012, pages 38
M. OTANI ET AL.: "Improvement of polymer type EB resist sensitivity and line edge roughness", PROCEEDINGS OF SPIE, vol. 8081, 2011, pages 808107/1 - 808107/8
T. YAMAGUCHI ET AL.: "Influence of molecular weight of resist polymers on surface roughness and line-edge roughness", J. VAC. SCI. TECHNOL. B, vol. 22, no. 6, 2004, pages 2604 - 2610, XP012074677, DOI: doi:10.1116/1.1805546
Attorney, Agent or Firm:
SUGIMURA, KENJI (JP)
Kenji Sugimura (JP)
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