POLYMER, RADIATION-SENSITIVE COMPOSITION, MONOMER, AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2011/040175

A1

Provided is a radiation-sensitive composition that can form a chemical-amplification positive resist that has excellent nano-edge roughness, sensitivity, and resolution and can precisely and stably form small-scale patterns. Also provided are a polymer, a monomer, and a manufacturing method therefor. The provided radiation-sensitive composition contains: an acid-labile-group-containing polymer that contains a repeating unit represented by general formula (1); and a radiation-sensitive acid-generating agent. (1) (In the formula, R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group; R2 represents a substituted or unsubstituted C6-22 aryl group; Y represents a carbon atom; X represents -X1Z1X2-, a group of atoms required to form a heteroatom-containing cyclic structure together with Y; Z1 represents -O-, -S-, -CO-, -COO-, -SO-, or -SO2-; X1 and X2 may be the same as or different from each other and each represent a single bond, a methylene group, or a C2-25 alkylene group; and a carbon atom in X1 may be bonded to a carbon atom in X2 in a divalent group.)

MARUYAMA KEN (JP)
KIMURA TOORU (JP)

PCT/JP2010/065066

April 07, 2011

September 02, 2010

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JSR CORP (JP)
MARUYAMA KEN (JP)
KIMURA TOORU (JP)

C08F212/04; C08F20/10; C08F220/10; C08F220/54; G03F7/004; G03F7/039; H01L21/027

JPH07325402A	1995-12-12
JP2000231194A	2000-08-22
JP2002082439A	2002-03-22
JP2002156760A	2002-05-31
JP2002351080A	2002-12-04
JP2002372785A	2002-12-26

KOJIMA SEIJI (JP)
Seiji Kojima (JP)

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