Title:
POLYMER, RESIN ADDITIVE, RESIN COMPOSITION, AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/204205
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polymer with which compatibility is improved when a polyester resin such as a poly(butylene terephthalate) resin is compounded with another resin and with which the tensile elongation of a molded body can be improved. This polymer has a first polymer portion and a second polymer portion. The first polymer portion is a polyester-based polymer. The second polymer portion has a constituent unit that is different from a constituent unit that constitutes the first polymer portion. The proportion of the first polymer is more than 20 parts by mass and not more than 90 parts by mass relative to a total of 100 parts by mass of the first polymer portion and the second polymer portion. The second polymer portion has a constituent unit derived from a (meth)acrylate monomer.
Inventors:
AOKI YUTAKA (JP)
Application Number:
PCT/JP2023/015445
Publication Date:
October 26, 2023
Filing Date:
April 18, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08F283/02; C08L25/04; C08L51/08; C08L67/00
Foreign References:
| JP2016135858A | 2016-07-28 | |||
| JP2017088868A | 2017-05-25 | |||
| JP2016161782A | 2016-09-05 | |||
| JP2019219643A | 2019-12-26 | |||
| US20150225562A1 | 2015-08-13 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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