Title:
POLYMER RESIN COMPOSITION AND APPLICATION THEREOF IN HIGH FREQUENCY CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/227789
Kind Code:
A1
Abstract:
The present invention relates to a vinyl benzyl ether modified poly(p-hydroxystyryl-styrene) polymer resin composition, comprising: (1) a vinyl benzyl ether modified poly(p-hydroxystyryl-styrene) polymer resin; (2) an olefin resin in which the weight ratio of butadiene having a 1,2-addition in the molecular structure is not less than 20%. The present invention also relates to a prepreg comprising the resin composition and an application thereof in a high frequency circuit board; a substrate prepared by using the resin composition has a low dielectric constant, low dielectric loss, a low thermal expansion coefficient and like comprehensive properties, and the area of a "+"-shaped drop mark formed on the substrate under a falling weight impact load is small, while the substrate has good toughness, and may satisfy the requirements for toughness of a copper-clad board.
More Like This:
Inventors:
CHEN GUANGBING (CN)
ZENG XIANPING (CN)
XU HAOSHENG (CN)
GUAN CHIJI (CN)
ZENG XIANPING (CN)
XU HAOSHENG (CN)
GUAN CHIJI (CN)
Application Number:
PCT/CN2017/100708
Publication Date:
December 20, 2018
Filing Date:
September 06, 2017
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L25/18; B32B15/04; C08K5/14; C08L25/06; C08L25/10; H05K1/03
Foreign References:
| CN101643565A | 2010-02-10 | |||
| CN87100741A | 1987-12-16 | |||
| CN1033065A | 1989-05-24 | |||
| CN105542457A | 2016-05-04 | |||
| CN101544841A | 2009-09-30 | |||
| US4784917A | 1988-11-15 | |||
| JPS62161846A | 1987-07-17 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
Download PDF:
Previous Patent: HIGH DIELECTRIC CONSTANT COMPOSITE MATERIAL AND APPLICATION THEREOF
Next Patent: HEATED INHALER AND HEATING ASSEMBLY THEREOF
Next Patent: HEATED INHALER AND HEATING ASSEMBLY THEREOF