Title:
POLYMER RESIN COMPOSITION, POLYIMIDE RESIN FILM, METHOD FOR PREPARING THE POLYIMIDE RESIN FILM, METAL STACKED STRUCTURE, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2013/032211
Kind Code:
A3
Abstract:
The present invention relates to a polymer resin composition which can provide an insulating material having superior mechanical properties and a low dielectric constant, to a polyimide resin film obtained using same, to a method for preparing the polyimide resin film, and to a metal stacked structure and circuit board including the polyimide resin film.
Inventors:
PARK SOON-YONG (KR)
Application Number:
PCT/KR2012/006869
Publication Date:
May 02, 2013
Filing Date:
August 28, 2012
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
PARK SOON-YONG (KR)
PARK SOON-YONG (KR)
International Classes:
C08L79/08; B32B15/088; C08G73/10; C08J5/18; H05K1/03
Foreign References:
| JP2002148804A | 2002-05-22 | |||
| KR20090019739A | 2009-02-25 | |||
| JP2001294704A | 2001-10-23 | |||
| KR20070113631A | 2007-11-29 | |||
| KR20010051941A | 2001-06-25 | |||
| KR20110084849A | 2011-07-26 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (649-10 Yoksam-dong Kangnam-ku, Seoul 135-080, KR)
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