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Patent Searching and Data


Title:
POLYMER RESIN-COPPER COMPLEX, AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/165919
Kind Code:
A3
Abstract:
The present invention relates to a polymer resin-copper complex which comprises i) copper, ii) nickel formed on the copper, and iii) a polymer resin which is treated with a triazine thiol-based derivative and then coupled to the nickel; and the result of X-ray photoelectron spectroscopy (XPS) analysis of the complex is that Ni content is less than 5% of the total content, which includes NiO and Ni2O3. According to the present invention, the complex improves the adhesive force between a metal and a resin, and as for tensile strength, even after thermal shock tensile strength is maintained. In addition, by using nickel and a triazing thiol-based derivative and utilizing methods, such as pretreatment, appropriate surface roughening, heat treatment, surface coating and the like, to increase binding force to a resin, it is possible to provide a metal-resin complex with excellent binding force between a metal and a resin.

Inventors:
JEONG EUH-DUCK (KR)
HAN HYUN-JU (KR)
HWANG BO-RAM (KR)
JIN JONG-SUNG (KR)
HA MYOUNG-GYU (KR)
KIM HYUN-GYU (KR)
HONG TAE-EUN (KR)
HONG KYONG-SOO (KR)
KIM JONG-PIL (KR)
BAE JONG-SEONG (KR)
JUNG HONG-DAE (KR)
LEE SU-JONG (KR)
Application Number:
PCT/KR2012/004372
Publication Date:
March 28, 2013
Filing Date:
June 01, 2012
Export Citation:
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Assignee:
TAESUNG POLITECH CO LTD (KR)
KOREA BASIC SCIENCE INST (KR)
JEONG EUH-DUCK (KR)
HAN HYUN-JU (KR)
HWANG BO-RAM (KR)
JIN JONG-SUNG (KR)
HA MYOUNG-GYU (KR)
KIM HYUN-GYU (KR)
HONG TAE-EUN (KR)
HONG KYONG-SOO (KR)
KIM JONG-PIL (KR)
BAE JONG-SEONG (KR)
JUNG HONG-DAE (KR)
LEE SU-JONG (KR)
International Classes:
B32B15/08; B32B15/20; C23C28/00
Foreign References:
KR20100082854A2010-07-20
KR100657729B12006-12-13
Attorney, Agent or Firm:
KIM, Sung-Hyun (223-6 Geoje 1-dong Yeonje-gu, Busan 611-803, KR)
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Claims: