Title:
POLYMER RESIN AND USE THEREOF IN HIGH-FREQUENCY CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/227745
Kind Code:
A1
Abstract:
The present invention relates to a poly(p-hydroxystyryl-styrene) polymer resin, the chemical structure thereof being as shown in formula (I), modified by a vinyl benzyl ether. The present invention further relates to a composition comprising the resin and the use thereof in a high-frequency circuit board. A substrate prepared by using the resin has comprehensive properties such as a high glass transition temperature, a low dielectric constant, a low dielectric loss, and a low thermal expansion coefficient, and is suitable for preparing a circuit substrate for high-frequency electronic devices.
Inventors:
ZENG XIANPING (CN)
CHEN GUANGBING (CN)
XU HAOSHENG (CN)
GUAN CHIJI (CN)
CHEN GUANGBING (CN)
XU HAOSHENG (CN)
GUAN CHIJI (CN)
Application Number:
PCT/CN2017/097336
Publication Date:
December 20, 2018
Filing Date:
August 14, 2017
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08F212/14; B32B15/14; B32B15/20; B32B17/02; B32B17/06; B32B33/00; C08F8/00; C08F212/08; C08J5/04; C08K7/14; C08L25/08; C08L25/18
Foreign References:
| CN101643565A | 2010-02-10 | |||
| US20080132131A1 | 2008-06-05 | |||
| US6071836A | 2000-06-06 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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