POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST

Title:

POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST

Document Type and Number:

WIPO Patent Application WO/2004/041881

Kind Code:

A1

Abstract:

A polymeric compound for photoresist, comprising monomer units having a skeleton of 2,6-dioxabicyclo[3.3.0]octane in its polymer structure. The monomer units having a skeleton of 2,6-dioxabicyclo[3.3.0]octane comprise monomer units of the formula: (I) wherein R represents hydrogen or methyl. The polymeric compound for photoresist may comprise monomer units having a skeleton of 2,6-dioxabicyclo[3.3.0]octane, monomer units having a group adherent to substrates and monomer units having an acid leaving group. The polymeric compound for photoresist excels in not only substrate adherence, acid leaving capability and dry etching resistance but also a balance of solubility in resist solvents and alkali solubility.

Inventors:

NISHIMURA MASAMICHI (JP)
KOYAMA HIROSHI (JP)
TSUTSUMI KIYOHARU (JP)

Application Number:

PCT/JP2003/013744

Publication Date:

May 21, 2004

Filing Date:

October 28, 2003

Export Citation:

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Assignee:

DAICEL CHEM (JP)
NISHIMURA MASAMICHI (JP)
KOYAMA HIROSHI (JP)
TSUTSUMI KIYOHARU (JP)

International Classes:

C08F20/28; C08F220/28; G03C1/76; G03F7/039; H01L21/027; G03F7/085; (IPC1-7): C08F220/28; G03F7/039

Foreign References:

JP2001323125A	2001-11-20
JP2002311590A	2002-10-23
JP2001302728A	2001-10-31

Other References: