Title:
POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN MOLDED BODY, CROSSLINKED RESIN MOLDED BODY, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2013/146660
Kind Code:
A1
Abstract:
The present invention is: a polymerizable composition containing a cycloolefin monomer mixture comprising a compound represented by formula (I) and another cycloolefin compound, a metathesis polymerization catalyst, and a crosslinking agent, the polymerizable composition being characterized by being obtained when a ring-opening polymerization reaction run at 170°C or lower generates a crosslinkable resin having an elastic modulus of 1.0 × 108 Pa or lower at both 100°C and 140°C and a crosslinking reaction of the crosslinkable resin generates a crosslinked resin having a glass transition point (Tg) of 160°C or higher; a crosslinkable resin molded body obtained by bulk-polymerizing the polymerizable composition; a crosslinked resin molded body obtained by crosslinking the crosslinkable resin molded body; and laminates obtained by laminating the resin molded bodies. According to the present invention, provided are: a polymerizable composition useful in producing a laminate having an extremely low dielectric loss tangent in high-frequency ranges and excellent heat resistance, wiring embedding performance, and peel strength; a crosslinkable resin molded body obtained by bulk-polymerizing the polymerizable composition; a crosslinked resin molded body obtained by crosslinking the crosslinkable resin molded body; and laminates obtained by laminating the resin molded bodies. (In the formula, R1, R2, and R3 each independently represent a hydrogen atom or a C1-20 hydrocarbon group; R4 represents a hydrogen atom or a methyl group; and A represents a single bond or a C1-20 divalent organic group. p represents 0, 1, or 2.)
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Inventors:
HOSHINO MANABU (JP)
Application Number:
PCT/JP2013/058538
Publication Date:
October 03, 2013
Filing Date:
March 25, 2013
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08G61/08; B32B27/00; C08J3/24; C08J5/04
Foreign References:
| JP2011074293A | 2011-04-14 | |||
| JP2011074271A | 2011-04-14 | |||
| JP2002293843A | 2002-10-09 |
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
Haruhito Oishi (JP)
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