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Title:
POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2011/074503
Kind Code:
A1
Abstract:
Provided is a polymerizable compound that imposes a low burden on the environment, requires little irradiance to undergo surface-hardening, and adheres well to a substrate material. Also provided are a photocurable composition and a photocurable moisture-resistant insulating coating material for a mounted circuit board. The provided compound has a structural unit derived from a dimer diol and has an end group represented by formula (1) (in which R1 represents H or CH3 and R2 represents a C2-12 hydrocarbon group). Preferably, the provided compound has end groups represented by formula (1) and formula (2) (in which each R3 independently represents CH3 or CH2CH3 and R4 represents a C3-9 hydrocarbon group). The structure having a structural unit derived from a dimer diol preferably is represented by formula (3).

Inventors:
OOGA, Kazuhiko (13-9 Shibadaimon 1-chome, Minato-k, Tokyo 18, 〒1058518, JP)
大賀 一彦 (〒18 東京都港区芝大門一丁目13番9号昭和電工株式会社内 Tokyo, 〒1058518, JP)
Application Number:
JP2010/072298
Publication Date:
June 23, 2011
Filing Date:
December 06, 2010
Export Citation:
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Assignee:
SHOWA DENKO K.K. (13-9, Shibadaimon 1-chome Minato-k, Tokyo 18, 〒1058518, JP)
昭和電工株式会社 (〒18 東京都港区芝大門一丁目13番9号 Tokyo, 〒1058518, JP)
OOGA, Kazuhiko (13-9 Shibadaimon 1-chome, Minato-k, Tokyo 18, 〒1058518, JP)
International Classes:
C08G18/81; C08F290/06; C08G18/83; C09D5/25; C09D175/16; H05K3/28
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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