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Title:
POLYOLEFIN COMPOSITE FILM
Document Type and Number:
WIPO Patent Application WO/2012/063914
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polyolefin composite film with excellent low-temperature heat sealability, heat-seal strength, and transparency. The disclosed polyolefin composite film has at least a surface layer (i), an intermediate layer (iii), and a core layer (ii), and is characterized by: the surface layer (i) comprising 0-50 wt% of a specified propylene/α-olefin random copolymer (A) and/or a specified 1-butene/α-olefin copolymer (E), and 50-100 wt% of a propylene polymer (B) with a fusion point of 120-170°C (provided the total of (A), (E), and (B) in the surface layer is defined as 100 parts by weight); the core layer (ii) comprising 70-100 wt% of a crystalline polypropylene (C) with a fusion point of 150-170°C, and 0-30 wt% of the specified propylene/α-olefin random copolymer (A) (provided the total of (C) and (A) in the core layer is defined as 100 parts by weight); and the intermediate layer (iii) comprising a propylene resin composition comprising 50-95 wt% of the crystalline polypropylene (C) with a fusion point of 150-170°C and 50-5 wt% of the propylene polymer (B) with a fusion point of 120-170°C, the specified propylene/α-olefin random copolymer (A), and/or the specified 1-butene/α-olefin copolymer (E) (provided the total of (C), (B), (A), and (E) in the intermediate layer is defined as 100 parts by weight).

Inventors:
AKAI IKUO (JP)
ABE TOMOHIRO (JP)
KUROKI TAKAYUKI (SG)
Application Number:
PCT/JP2011/075984
Publication Date:
May 18, 2012
Filing Date:
November 10, 2011
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
AKAI IKUO (JP)
ABE TOMOHIRO (JP)
KUROKI TAKAYUKI (SG)
International Classes:
B32B27/32; B65D65/40; C08F210/06
Foreign References:
JP2005305998A2005-11-04
JP2006327183A2006-12-07
JP2004167905A2004-06-17
JP2009172845A2009-08-06
Other References:
See also references of EP 2639062A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
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Claims: