Title:
POLYOLEFIN RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2011/030922
Kind Code:
A1
Abstract:
Disclosed is a polyolefin resin composition containing 30-90 mass % of a polyolefin resin (A), 1-50 mass % of an aliphatic polyester resin (B), 1-40 mass % of an ethylene-octene rubber (C) having a melt flow rate of over 3 g / 10 min and no more than 40 g / 10 min, and 0.01-20 mass % of an ethylene polymer (D) containing an epoxy group, and a molded body obtained by molding said composition has excellent tensile elongation and shock resistance.
Inventors:
KAMEO KOJI (JP)
SHIMANO MITSUYOSHI (JP)
SHIMANO MITSUYOSHI (JP)
Application Number:
PCT/JP2010/066002
Publication Date:
March 17, 2011
Filing Date:
September 09, 2010
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
KAMEO KOJI (JP)
SHIMANO MITSUYOSHI (JP)
KAMEO KOJI (JP)
SHIMANO MITSUYOSHI (JP)
International Classes:
C08L23/00; C08L67/00
Domestic Patent References:
| WO2009078376A1 | 2009-06-25 | |||
| WO2009078375A1 | 2009-06-25 | |||
| WO2008126359A1 | 2008-10-23 | |||
| WO2008078802A1 | 2008-07-03 |
Foreign References:
| JP2008222865A | 2008-09-25 | |||
| JP2007277444A | 2007-10-25 | |||
| JP2006077063A | 2006-03-23 | |||
| JPH08134283A | 1996-05-28 | |||
| JPH06263892A | 1994-09-20 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
Nakayama δΊ¨ (JP)
Nakayama δΊ¨ (JP)
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