Title:
POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1999/043751
Kind Code:
A1
Abstract:
A polyoxymethylene resin composition comprising (A) 99 to 50 parts by weight of a polyoxymethylene resin, (B) 1 to 50 parts by weight of wollastonite having a volume-average particle diameter of 0.5 to 40 $g(m)m, (C) 0.1 to 10 parts by weight of at least one member selected from the group consisting of alcohol/fatty acid esters, alcohol/dicarboxylic acid esters, and polyoxyalkylene glycol compounds, and (D) 0.1 to 10 parts by weight of a polyolefin resin, the amounts of ingredients (C) and (D) each being per 100 parts by weight of the sum of ingredients (A) and (B). Compared to conventional compositions, the composition gives a molded article which has excellent frictional and wear properties, high rigidity, and high strength in repeated impact and is reduced in molding strain and excellent in gear precision. It is therefore possible to provide a new material usable as electrical and electronic parts which are increasingly being miniaturized.
Inventors:
HORIO MITSUHIRO (JP)
YOSHINAGA YUUJI (JP)
YOSHINAGA YUUJI (JP)
Application Number:
PCT/JP1999/000757
Publication Date:
September 02, 1999
Filing Date:
February 22, 1999
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
HORIO MITSUHIRO (JP)
YOSHINAGA YUUJI (JP)
HORIO MITSUHIRO (JP)
YOSHINAGA YUUJI (JP)
International Classes:
C08L59/02; (IPC1-7): C08L59/00; C08K13/02
Foreign References:
| JPS61120848A | 1986-06-07 | |||
| JPH04252232A | 1992-09-08 | |||
| JPH0995594A | 1997-04-08 | |||
| JPH0711101A | 1995-01-13 | |||
| JPH0726112A | 1995-01-27 | |||
| JPH07502768A | 1995-03-23 | |||
| JPH09286899A | 1997-11-04 | |||
| JPH09286897A | 1997-11-04 | |||
| JPH09132694A | 1997-05-20 | |||
| JPH10237268A | 1998-09-08 |
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