Title:
POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2001/032775
Kind Code:
A1
Abstract:
A polyoxymethylene resin composition which comprises (A) a polyoxymethylene resin, (B1) a polyolefin resin on which a silicone compound has been grafted, and (B2) a silicone compound, wherein the amount of the silicone-grafted polyolefin resin (B1) is 0.05 to 10 parts by weight per 100 parts by weight of the polyoxymethylene resin (A) and the (B1)/(B2) weight ratio is from 99/1 to 70/30. The resin composition gives a molding having excellent sliding properties while retaining the thermal stability of the polyoxymethylene resin, gives a thin-wall molding greatly improved in release properties, and is prevented from deteriorating in sliding properties upon contact with a solvent, e.g., a dry-cleaning solvent. It is useful in applications such as electric/electronic parts, which are recently becoming smaller more and more, and in applications such as buckles, zippers, and clips.
Inventors:
HORIO MITSUHIRO (JP)
YOSHINAGA YUUJI (JP)
YOSHINAGA YUUJI (JP)
Application Number:
PCT/JP2000/007574
Publication Date:
May 10, 2001
Filing Date:
October 27, 2000
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
HORIO MITSUHIRO (JP)
YOSHINAGA YUUJI (JP)
HORIO MITSUHIRO (JP)
YOSHINAGA YUUJI (JP)
International Classes:
C08L59/02; C08L59/04; (IPC1-7): C08L59/00; C08J5/00
Foreign References:
| JPH09286899A | 1997-11-04 | |||
| US5173532A | 1992-12-22 |
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Building 2-1 Ohtemachi 2-chome Chiyoda-ku, Tokyo, JP)
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